Michael has expertise in the design and micro-fabrication of Photonic Integrated Circuit (PIC) technologies across a wide range of material platforms. This work covers the development of devices and subsystems for on-chip photonics, sensing, non-linear optics and ICT. Key collaborations with industrial partners ensure the future scalability and foundry compatibility of these techniques.
A particular focus is the heterogeneous integration of different opto-electronic materials into multi-functional photonic systems.
Low energy consumption photonic components for interconnects and future network systems.
Structured illumination LED sources for imaging and data communications. Wide-bandgap integrated
optics (GaN, diamond).
Heterogeneous PIC development for large scale integration.